Figure 1 shows the evolution of datacom transceivers through five generations of technology. Modern CMOS packaging techniques, including those originally developed for the cell phone and IT industries, are being applied to silicon photonic integrated circuits (PICs), resulting in much lower costs and far improved scalability. The key drivers for using silicon for photonics include the advantages of low-loss silicon waveguides with compact size and excellent uniformity, resulting from the high quality and mature processing of the silicon CMOS ecosystem.
It enables a wide range of applications from datacom and telecom to sensors including light detection and ranging (LIDAR), gyroscopes, biosensors, and spectrometers.
Silicon photonics research and commercialization has intensified as both photonic component performance and photonic integration complexity have been dramatically improved and expanded in the past decade.
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